TEAMGROUP Launches All-Round Storage Solutions at COMPUTEX 2021

C.B.Desk: Leading memory brand TEAMGROUP is returning to COMPUTEX 2021 with all of its sub-brands with full force. In response to the COVID-19 pandemic that continues to ravage the globe, the organizers of COMPUTEX have canceled the physical exhibition and switched to an online dual platform exhibition (exhibition dates: 5/31/2021–6/30/2021). As a Taiwanese brand, TEAMGROUP is excited to launch three all-round storage solutions simultaneously at this year’s online COMPUTEX expo. The three themes of the products are `heat dissipation’, `large storage capacity’ and `DDR5′, which corresponds with TEAMGROUP’s slogan at the 2021 online expo: “Chill the Heat, Feel the Speed, Make it Big”. The exhibition will unveil TEAMGROUP’s all-round solutions, and consumers will be able to get a first glimpse of TEAMGROUP’s exciting showcase video on its official social media pages and COMPUTEX’s dual online platforms. TEAMGROUP’s 2021 showcase begins with the theme of “heat dissipation”, followed by “large storage capacity” and lastly, the new generation of “DDR5”.

Innovative material design with industry-leading “heat dissipation” technology: M.2 PCIe SSDs run into throttling issues when running at high speeds for long periods of time. TEAMGROUP offers heat dissipating solutions made with innovative materials, such as its invincible aluminum fin patented heat sinks, ultra-thin patented graphene heat sinks, and aerospace ceramic heat sinks, which can all significantly improve cooling. These innovations have earned invention and utility model patents across the Chinese-speaking markets.

The T-FORCE CARDEA A440 PCIe4.0 SSD is the first in the industry to incorporate two patented heat sinks, giving you the benefits of a patented invincible aluminum heat sink and a patented ultra-thin graphene heat sink all at once and the flexibility to choose your preferred cooling method. As long as you have a motherboard that supports the M.2 PCIe SSD interface, the CARDEA A440 PCIe4.0 SSD can offer the right cooling solution, which allows gamers to choose the best heatsink that fits their needs. This unique offering exhibits TEAMGROUP’s ingenuity in designing.

The T-FORCE R&D team created the heatsinks of the CARDEA Ceramic C440 SSD with innovative aerospace ceramic materials. Ceramic heat sinks not only provide better cooling (high watts of dissipation, no heat storage, and direct heat dissipation), they are also thin and light and resistant to electromagnetic interference, high temperatures, and thermal shock. The C440’s heat sink is only about 1mm, which eliminates many structural installation issues. The CARDEA Ceramic SSD elevates one’s gaming experience and daily work efficiency while brightening desktops with its elegant white and gold finish.

Offers massive storage capacity and solves the problem of insufficient space:  Nowadays, data grows exponentially. To solve the problem of insufficient storage, TEAMGROUP looks ahead, launching large-capacity memory, solid-state drives, and memory cards for consumers around the world. The T-FORCE R&D team continuously surpasses previous limits, introducing higher frequency memory as well as increased memory capacities.

During this year’s COMPUTEX, the T-FORCE team is targeting the high-end Intel & AMD HEDT (high-end desktop) platforms that require ultra-high performance computing by launching the T-FORCE XTREEM ARGB DDR4-3600MHz CL18-22-22-42 256GB (8 x 32GB) ultra-large capacity memory 8-module kit. The T-FORCE XTREEM ARGB won the Red Dot Design Award for its marvelous mirror finish and brilliant lighting that penetrates the heat spreader and creates a dazzling layered effect. It meets the large capacity requirements of high-end workstations, video and audio editing, and scientific computing. The XTREEM ARGB is also the best choice for gamers seeking top memory performance.

In an era of pursuing flash stacking technology, capacity and read/write performances are the top specs consumers look for when choosing an SSD. The MP34Q M.2 PCIe SSD, which is being unveiled at the expo, features the latest 3D QLC flash memory and offers up to an immense 8TB of storage while coming in a small form factor, meeting the storage and computing requirements for AI. In addition to having a transfer speed of over 3000MB per second, the MP34Q M.2 PCIe SSD has low power consumption, earthquake resistance, and noiseless, making it the top choice for high capacity and performance SSDs.

In addition to having a variety of specifications to meet the demands for different applications, TEAMGROUP’s memory products also place great importance on fast read/write and transfer speeds. Huge capacity models with 1TB will be released for the popular GAMING A2 CARD and GO 4K Micro SDXC UHS-I product lines. The T-FORCE GAMING A2 CARD is made specifically for mobile and handheld gamers. Featuring a large capacity of up to 1TB, it provides the ultimate removable media solution for portable entertainment devices. Whether for accessing games, movies, music, or books, the GAMING A2 CARD can meet all your entertainment media needs. With read/write speeds of up to 100/90 MB/s, loading time can be significantly reduced, providing a more seamless experience. It is the ultimate choice for handheld game consoles, smartphones, and tablets.

The GO 4K Micro SDXC UHS-I is specially designed for extreme sports photography. With the massive capacity of 1TB, users who engage in outdoor sports do not have to worry about running out of storage. Whether you are hiking, diving or skiing, the GO 4K Micro SDXC lets you record every second in high-definition video. It provides the speed and storage you need to film more of your outdoor adventures in 4K UHD and capture exciting moments of your life whenever you want.

Successfully taken the lead over competing PCB manufacturers in creating consumer DDR5 memory: With the new generation of memory arriving soon, TEAMGROUP has taken the lead to release a DDR5 memory module under its globally top-selling ELITE memory product line. It will come with 16GB and run at 4,800MHz. To increase the memory access performance of the improved architecture, the number of bank groups is doubled that of DDR4. The operating voltage is lowered from 1.2 V to 1.1 V, and data transfer rates have risen from 4,800 Mbps to 5,200 Mbps. That is a 10% reduction in power consumption and an increase of 60% in transfer rate. Furthermore, today’s DDR4 memory requires an additional chip if ECC error correction is needed, but the new DDR5 memory comes with on-die ECC to automatically repair itself and significantly improve system stability. TEAMGROUP’s exciting new generation of DDR5 products is releasing soon and will surely impress.

For COMPUTEX 2021, TEAMGROUP is also hosting an online giveaway where participants have a chance to win excellent prizes. Please stay tuned to the official TEAMGROUP website and the official fan page for information. Watch TEAMGROUP’s 2021 online exhibition from anywhere in the world to see the spectacular new pieces of technology.